Job Description
Job Description
Join the Wafer Assembly Technology Development Group (WATD)
As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
Key Responsibilities
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
- Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
- Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Partner with cross-functional teams to ensure process integration and alignment with project deliverables.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
- OR PhD in the same fields with 2+ years of experience.
Experience listed above should be a combination of the following:
- Development methodologies, statistical process control, and/or data analytics.
- Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
- Demonstrated expertise in leading programs from early strategy formation through high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
Powered by SonicJobs (an advertiser on Veritone). By applying, you consent to share your data with SonicJobs and the employer. Veritone or SonicJobs does not store or use your application data beyond facilitating the application.
See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions
Job Description
Join the Wafer Assembly Technology Development Group (WATD)
As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
Key Responsibilities
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
- Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
- Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Partner with cross-functional teams to ensure process integration and alignment with project deliverables.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
- OR PhD in the same fields with 2+ years of experience.
Experience listed above should be a combination of the following:
- Development methodologies, statistical process control, and/or data analytics.
- Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
- Demonstrated expertise in leading programs from early strategy formation through high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
Powered by SonicJobs (an advertiser on Veritone). By applying, you consent to share your data with SonicJobs and the employer. Veritone or SonicJobs does not store or use your application data beyond facilitating the application.
See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions